We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for EXPRESS Module.
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EXPRESS Module Product List and Ranking from 14 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated: Aggregation Period:Feb 18, 2026~Mar 17, 2026
This ranking is based on the number of page views on our site.

EXPRESS Module Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Feb 18, 2026~Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. V-net AAEON Kanagawa//Industrial Electrical Equipment
  2. ADLINKジャパン 東京本社 Tokyo//Industrial Electrical Equipment
  3. アドバンテック Tokyo//Industrial Electrical Equipment
  4. 4 Advanet Inc HQ Okayama//Industrial Electrical Equipment
  5. 5 ポートウェルジャパン Tokyo//Industrial Electrical Equipment

EXPRESS Module Product ranking

Last Updated: Aggregation Period:Feb 18, 2026~Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. PCI Express board "AdEXP1572" Advanet Inc HQ
  2. Industrial COM Express Module [NANOCOM-RAP] V-net AAEON
  3. Industrial COM Express Module [COM-ASLC6] V-net AAEON
  4. Industrial COM Express Module [NANOCOM-ASL] V-net AAEON
  5. 5 COM Express with 11th Generation Intel Core アドバンテック

EXPRESS Module Product List

1~30 item / All 114 items

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Digital Input/Output PCI Express Board 16ch/16ch

PCI Express bus-compliant interface board, capable of up to 16 inputs and up to 16 outputs with a single board.

This is a PCI Express bus-compliant interface board that performs input and output of digital signals (12 - 24VDC). It can handle up to 16 input points and up to 16 output points with a single board. It has built-in protection circuits for output transistors (surge voltage, overcurrent). 【Main Features】 ● Photocoupler isolated input (supports current sink output), photocoupler isolated open collector output (current sink type) ● Bus isolation via photocoupler ● All input signals can be used as interrupt inputs ● Equipped with a digital filter function to prevent misrecognition of input signals due to noise and chattering ● Built-in Zener diode for surge voltage protection and overcurrent protection circuit in the output circuit. The rated output signal is a maximum of 35VDC and 100mA per point.

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  • dio-1616l-pe_rgb_96dpi_500x500.jpg
  • Expansion Boards
  • Embedded Board Computers
  • EXPRESS Module

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COM Express with 11th Generation Intel Core

Excellent performance with the 11th generation Intel 10nm processor and Iris Xe graphics!

The "SOM-6883" is an AI acceleration-enabled product equipped with the 11th generation Intel Core processor based on a 10nm microarchitecture, combining both CPU and GPU. It offers excellent computing performance that is up to 25% faster compared to the previous model, along with 2.95 times the graphics performance, low power consumption, and immediate responsiveness for real-time communication. Additionally, it is the first COM Express Compact module to support up to four independent 4K outputs or two 8K HDR outputs, thanks to the Intel Iris Xe GPU, which can configure up to 96 GPU cores and dual video decoder boxes. 【Key Features of this Product】 ■ 11th Generation Intel Core Processor U Series ■ COM Express R3.0 Compact Module Type 6 pin layout ■ Dual channel with 1 x memory down and 1 x SODIMM ■ High-speed I/O: 1 PCIe x4 Gen4, 5 PCIe x1 Gen3, 4 USB3.2 Gen2 ■ Up to 64GB onboard NVMe x4 SSD, TPM 2.0

  • SOM-6883_Front_Square20200923160322.jpg
  • Embedded Board Computers
  • EXPRESS Module

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AMD Ryzen V2000 equipped COM Express

Achieve powerful performance in a compact COM Express form factor!

SOM-6872 delivers excellent performance with 8 cores, 16 threads, turbo boost (up to 4.25GHz), and supports 4x 4K displays. It also features a diverse range of built-in I/O, providing outstanding graphics performance without the need for additional GPU cards. This solution is ideal for graphics-intensive applications such as digital signage, medical imaging, machine vision, and gaming. 【Key Features of This Product】 ◆ COM Express R3.0 Compact Type 6 module equipped with AMD Ryzen Embedded V2000 SoC ◆ Supports 2 x DDR4-3200 SODIMM dual-channel memory, up to 64GB of ECC/non-ECC memory ◆ USB 3.2 Gen2×2, PCIe x8 Gen3×1, PCIe x1 Gen3×8, GbE×1, SATA 3.0×2 ◆ Supports a wide operating temperature range (0 to 60°C) ◆ Supports 4 x 4K displays (DP++, HDMI, VGA, LVDS) ◆ Thermal solution "QFCS" enables 100% CPU performance without throttling

  • SOM-6872_3D  .png
  • Embedded Board Computers
  • EXPRESS Module

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Edge Intelligence - Edge AI Solution SOM-6873

AMD Ryzen Embedded 8000 equipped COM Express Compact Module Type 6

- COM Express R3.1 Compact module Type 6 pin configuration - High-performance CPU: AMD RYZEN Embedded 8000, Zen4 up to 8C/16T - Equipped with AMD Radeon RDNA3 graphics, capable of outputting 4K resolution on 4 screens - NPU: AMD XDNA, 16 TOPS - Memory: Dual channel DDR5/SO-DIMM rocket, up to 96GB - High-speed I/O: 2.5GbE, PCIe Gen 4, USB 3.2 Gen2, SATA3.0 - iManager, embedded software API, WISE-DeviceOn compatible *For more details, please download the PDF (English version) or feel free to contact us.

  • SOM-6873 2.png
  • SOM-6873 3.png
  • Embedded Board Computers
  • Industrial PCs
  • EXPRESS Module

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COM Express module "PCOM-B634VG"

Intel 5th Generation Xeon Compatible Type 6 COM Express

The COM Express module "PCOM-B634VG" supports Intel's 5th generation Xeon and allows for system memory expansion up to 48GB with DDR4-2400 ECC/non-ECC SoDIMM. It is compatible with 10GbE Ethernet. For more details, please download the catalog.

  • Industrial PCs
  • EXPRESS Module

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COM Express module "PCOM-B637VG"

Industry's first Type 6 COM Express compatible with Intel 6th generation Core i (Skylake-S) desktop processors.

The COM Express module "PCOM-B637VG" supports the industry's first Intel 6th generation Core i (Skylake-S) desktop processor, and the system memory can be expanded up to 16GB with DDR4 2133 ECC/non-ECC SoDIMM. It supports 4 high-speed PCI-Express Gen3. For more details, please download the catalog.

  • Industrial PCs
  • EXPRESS Module

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COM Express module "PCOM-B639VG"

Intel 6th Generation Core i (Skylake-H) compatible Type 6 COM Express

The COM Express module "PCOM-B639VG" supports Intel's 6th generation Core i (Skylake-H) and allows for system memory expansion up to 32GB with DDR4 2133 ECC/non-ECC SoDIMM. It supports 4 high-speed PCI-Express Gen3. For more details, please download the catalog.

  • Industrial PCs
  • EXPRESS Module

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COM Express module "PCOM-BA00"

Intel ATOM E3800 series (BayTrail SoC) compatible Type 10 COM Express module

The COM Express module "PCOM-BA00" is compatible with the Intel ATOM E3800 series (Bay Trail SoC) and allows for system memory expansion up to a maximum of 4GB with DDR3L 1066/1333 SDRAM. For more details, please download the catalog.

  • Industrial PCs
  • EXPRESS Module

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COM-Express Type 6『PCOM-B655VGL』

Equipped with a desktop CPU! It achieves high performance at a low price, offering excellent cost performance.

The "PCOM-B655VGL" is a COM-Express Type 6 module compatible with the 10th generation Intel Core processors (Comet Lake-S). It now supports DDR4 memory and USB 3.1 Gen2. A total of 24 lanes are available for PCI-Express Gen3. Since it can accommodate desktop CPUs, it achieves higher performance at a lower price compared to mobile-type CPUs, offering excellent cost performance. 【Features】 ■ Equipped with Intel 10th generation Core processors (Comet Lake-S) ■ Can accommodate 2 DDR4-2933/2666 So-DIMMs ■ Supports a total of 24 lanes of PCI-Express Gen3 ■ Compatible with socket-type desktop CPUs *For more details, please download the PDF or feel free to contact us.

  • Printed Circuit Board
  • EXPRESS Module

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COM Express board "Adbc9502"

COM Express Basic Type 6, AMD Ryzen Embedded V1000/R1000

<Features> ■ Equipped with AMD Ryzen Embedded V1000/R1000 processors ■ 2x DDR4-2400 SO-DIMM, up to 32GB ECC support ■ Triple display support via HDMI/DVI/DisplayPort/LVDS or eDP (through carrier board) ■ 4x USB3.1, 8x USB 2.0, 2x SATAIII ■ TPM (2.0) support

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  • Other FA equipment
  • EXPRESS Module

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[Information] COM Express Computer Form Factor

What is COM Express in the first place! Introducing the types of form factors and their benefits.

This document includes the form factor of COM Express computers. We provide a detailed introduction to the new fanless COM-E module "CPU-162-24" for rugged HPEC applications. Additionally, we explain "What is COM Express?" and "Benefits of COM Express," making it a useful reference when considering implementation. We encourage you to read it. [Contents] ■ What is COM Express? ■ Benefits of COM Express ■ Eurotech's new COM Express Type 6 module for HPEC ■ Use Case: Controller for Mitsubishi Power Corporation's thermal power plant ■ Hypothetical Scenario: Data collection solution for hydropower plants *For more details, please refer to the PDF document or feel free to contact us.

  • Embedded Board Computers
  • EXPRESS Module

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COM Express Compact【cExpress-R8】

COM Express Type 6 Compact with AMD Ryzen Embedded 8000 series processor

The cExpress-R8 is a COM Express COM.0 R3.1 Type 6 Compact module equipped with AMD Ryzen Embedded 8000 series processors (8845HS, 8840U, 8645HS, 8640U), achieving industrial performance across different dimensions. This module, featuring up to 8 "Zen 4" cores (16 threads), integrated AMD RDNA 3 graphics, and an XDNA NPU, delivers up to 39 TOPS of performance, enabling power-efficient AI inference and rapid decision-making in industrial edge environments. The cExpress-R8 supports dual-channel DDR5 memory (non-ECC/ECC options available) of up to 96GB with a speed of 5600 MT/s, providing exceptional responsiveness and performance. It can also drive up to 4 independent displays (DP, eDP, HDMI, LVDS, or VGA), making it ideal for advanced visual applications.

  • Embedded Board Computers
  • EXPRESS Module

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COM Module Comprehensive Catalog 2017 Edition [Free Distribution!]

We are currently offering a comprehensive catalog of COM modules for free! We are also introducing our new product, 'COM Express Type 7'!

ADLINK, a manufacturer of embedded computing technology, leads the industry in computational performance, robust design, high availability, and the integration of industrial I/O. In conjunction with ESEC 2017 (Embedded Systems Development Technology Exhibition), we are offering a comprehensive catalog from ADLINK Japan for free! It also includes an introduction to our new product, COM Express Type 7. Please download it from the link below. 【Catalog Contents】 ● Comprehensive COM Module Catalog This comprehensive catalog spans 68 pages, featuring company information, IoT solutions, SEMA, SEMA Cloud, high robustness design, medical applications, case studies, product introductions, and more. <Case Studies> Medical, industrial automation, transportation, infotainment, defense ● COM Express Type 7 We introduce the COM Express Type 7, which supports up to four 10GbE-KR interfaces, making it ideal for cutting-edge "node-server" applications required in IoT and Industry 4.0. * For more details, please download from the link below or contact us.

  • Embedded Board Computers
  • EXPRESS Module

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COM Express【Express-KL/KLE】

7th generation Intel Xeon, Core equipped basic size COM Express Type 6 module

The ADLINK Express-KL/KLE (codename: Kaby Lake), which incorporates SEMA functionality, is an off-the-shelf solution for Internet of Things (IoT) applications. The Express-KL/KLE connects traditional industrial devices and other IoT systems to the cloud, allowing for the extraction of raw data from these devices and determining which data to store locally and which to send to the cloud for further analysis. These analytical results can provide valuable information for policy-making and create innovative business opportunities.

  • Embedded Board Computers
  • EXPRESS Module

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COM Express【Express-CF/CFE】

Basic Size COM Express Type 6 Module

The ADLINK Express-CF / CFE computer-on-module, equipped with SEMA functionality, is designed for Internet of Things (IoT) applications. The Express-CF / CFE connects legacy industrial devices and other IoT systems to the cloud, allowing for the extraction of raw data from these devices and determining which data to store locally and which data to send to the cloud for future analysis. These analytical results can provide valuable information for policy-making and create innovative business opportunities.

  • Embedded Board Computers
  • EXPRESS Module

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COM Express【Express-SL2】

COM Express Basic Size Type 2 module equipped with 6th generation Intel Core/Xeon/Celeron processors.

ADLINK announces a new COM Express Type 2 computer-on-module based on the highly popular Intel Core processors (formerly codenamed Skylake and Kabylake). The Express-SL/KL supports all Type 2 related legacy I/O, allowing customers to extend the production lifespan of their existing Type 2-based systems by at least 10 years.

  • Embedded Board Computers
  • EXPRESS Module

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COM Express【cExpress-WL】

COM Express compact size Type 6 module equipped with the largest quad-core Intel Core and Celeron processors.

ADLINK has announced its latest COM Express Type 6 module to meet the needs of edge computing applications constrained by size, weight, and power consumption (SWaP). The ADLINK cExpress-WL module features 8th generation Intel Core and Celeron processors (formerly codenamed Whiskey Lake-U) with up to 4 cores and a maximum memory capacity of 64GB, delivering performance and responsiveness without compromise despite SWaP constraints. The cExpress-WL is suitable for applications such as data acquisition and analysis, image processing, 4K video transcoding, and edge streaming.

  • Embedded Board Computers
  • EXPRESS Module

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Compact COM Express【cExpress-AR】

COM Express compact size Type 6 module equipped with AMD Ryzen Embedded V2000 APU.

The cExpress-AR, equipped with the new AMD Ryzen V2000 APU and high-performance integrated Radeon graphics, is the first Type 6 module in the market to support up to 16 threads of octa-core (8 cores) embedded SoC, achieving significant turbo boost up to 4.2 GHz. Compared to the previous embedded quad-core V1000 processor, the combination of additional cores and AMD's Zen 2 architecture has more than doubled performance and improved efficiency per watt by twofold. ADLINK's cExpress-AR standardly supports up to 64GB of DDR4 with two SO-DIMM slots. It offers ECC error correction and configurable TDP (up to 10W) based on the selected SKU, while providing 6 to 8 cores and passive cooling, making it suitable for mission-critical applications in harsh environments.

  • Embedded Board Computers
  • EXPRESS Module

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Compact COM Express【cExpress-EL】

Next-generation Intel Atom processor SoC equipped COM Express compact size Type 6 module.

The ADLINK cExpress-EL supports the next-generation Intel Atom x6000 processor (Elkhart Lake) combined with Intel UHD graphics in a low-power envelope and high-speed interfaces. The cExpress-EL module supports up to 32GB of in-band ECC dual-channel DDR4 memory and is available in a robust operating temperature range and low-power envelope, making it ideal for mission-critical fanless edge computing applications that always require safety and reliability.

  • Embedded Board Computers
  • EXPRESS Module

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COM Express【Express-CFR】

Basic Size COM Express Type 6 Module

The Express-CFR is a COMExpress COM.0R3.0 basic size Type 6 module that supports hexacore (6-core) 64-bit 9th generation Intel Core and Xeon processors (codename "Coffeelake Refresh-H"). It is equipped with Mobile Intel QM370, HM370, and CM246 chipsets. The Express-CFR features up to three SODIMM sockets that support a maximum of 96GB of DDR4 memory (with two on the top by default and one on the bottom as a build option). It fully complies with the mechanical specifications of PICMG COM.0. Modules with Xeon processors and the CM246 chipset support both ECC SODIMM and non-ECC SODIMM.

  • Embedded Board Computers
  • EXPRESS Module

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COM Express Type 10【nanoX-EL】

Elkhart Lake equipped with COM Express Type 10 Mini module.

The ADLINK nanoX-EL is a COM Express Type 10 module that supports Intel Atom x6000 series processors (x6425E, x6413E, x6211E, x6200FE, x6425RE, x6414RE, x6412RE), Intel Pentium, and Celeron N/J series processors (formerly codenamed Elkhart Lake), and features a high-speed interface with integrated Intel UHD graphics. The nanoX-EL module supports up to 16GB of in-band ECC LPDDR4 memory and is designed for robust operating temperature ranges and low power consumption, making it ideal for mission-critical fanless edge computing applications where safety and reliability are always required.

  • Embedded Board Computers
  • EXPRESS Module

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COM Express【Express-RLP】

COM Express Rev.3.1 Type 6 basic size module equipped with 13th generation Intel Core mobile processor.

The ADLINK Express-RLP COM Express Type 6 basic size module is the first COM Express based on the 13th generation Intel Core mobile processor, utilizing Intel's advanced hybrid architecture (with up to 6 performance cores and 8 efficient cores) offered with industrial options, providing excellent performance for edge IoT innovation across a variety of power ranges (TDP 15W/28W/45W). This module supports PCIe 4.0 and DDR5 memory with speeds of up to 4800 MT/s, as well as 4 displays via DDI/LVDS or USB4/TBT4, and features integrated Intel Iris Xe graphics with up to 96 execution units, enabling on-device AI performance instantly.

  • Embedded Board Computers
  • EXPRESS Module

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COM Express Type 6 Alder Lake-P

Intel 12th Generation Core i5-12600HE-based COM Express Type 6 Prototyping Kit

The COM Express Type 6 Alder Lake-P is a powerful IoT solution development kit based on COM Express Type 6, featuring the Intel 12th generation i5-12600HE 12-core (4 P-cores + 8 E-cores) SoC, integrated with Intel Iris Xe GPU graphics (80 execution units) and comprehensive high-speed interfaces. This kit, focused on performance and power efficiency, incorporates a COM Express module that utilizes Intel's advanced hybrid architecture, leveraging four performance cores for IoT workloads and eight efficient cores for background task management. It provides excellent performance and power per watt, offering high flexibility to enable a wide range of smart edge innovations with a TDP of 35/45W. This module and development kit, equipped with 64GB of memory and integrated Intel Iris Xe graphics with 80 execution units, will be key for the development and prototyping of various industrial IoT applications specialized in graphics and AI.

  • Embedded Board Computers
  • EXPRESS Module

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COM Express【Express-VR7】

AMD Embedded Ryzen V3000 equipped COM Express Rev.3.1 Basic Type 7 module

The ADLINK COM Express Type 7 Basic size module "Express-VR7" is based on the AMD Embedded Ryzen V3000 series processor. With up to 8 cores and 16 threads, and a TDP of 15W/45W, it delivers the best performance per watt in its class, featuring 14 PCIe Gen4 lanes, enterprise-level reliability, and extremely robust temperature options (-40℃ to 85℃). This module offers dual-channel DDR5 memory with ECC at 4800MT/s, equipped with 2x 10G Ethernet and 1x 2.5GB Ethernet, making it ideal for various next-generation network applications at the edge.

  • Embedded Board Computers
  • EXPRESS Module

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Industrial COM Express Module [HPC-RPSC]

AAEON 12th/13th Generation HPC Client Size C Standard Industrial COM Express Module

Features ● DDR5 4800 MHz SO-DIMM x2 (up to 64GB) ● USB 2.0 x8, USB 3.2 x6 ● PCIe [x1] x8, PCIe [x4] x3, PEG [x16] x1 ● Intel I226-LM 2.5GbE x2 ● M.2 2280 M-Key x1 ● COM HPC Client Type, Size C (160 x 120mm)

  • HPC-RPSC_2.jpg
  • Other electronic parts
  • EXPRESS Module

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Industrial COM Express Module [COM-RAPC6]

AAEON Industrial COM Express Module Type 6 Compact Size

Features ● 13th Generation Intel Core i7-13800HE/i7-13800HRE/i5-13600HE/i3-1320PE/Processor U300E SoC (maximum TDP 45W) ● DDR5 SODIMM x 2 (maximum 64GB, non-ECC) ● Intel i226 GbEx 1 ● SATA 6.0Gbps x 2 ● USB3.2 Gen2 x 4, USB2.0 x 8 ● Maximum PCIe x 6 ● DC 12V input ● COM Express Type 6, compact size (95 x 95mm)

  • COM-RAPC6l_1.jpg
  • COM-RAPC6l_2.jpg
  • Embedded Board Computers
  • EXPRESS Module

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Industrial COM Express Module [COM-ADNC6]

AAEON Industrial COM Express Module Type 6 Compact Size

Features ● Intel Atom x7425E/N50/N97/Core i3-N305 CPU (maximum TDP 15W) ● DDR5 SODIMM x 1 (maximum 16GB, non-ECC) ● Intel I226-V/I226-IT Gigabit Ethernet x 1 ● SATA 6Gb/s x 2 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe [x4] (PCIe [x1] x 4 or [x2] x 2) (maximum PCIe x 4) ● COM Express Type 6, compact size (95 x 95mm)

  • COM-ADNC6_1.jpg
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  • Embedded Board Computers
  • EXPRESS Module

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Industrial COM Express Module [NANOCOM-RAP]

AAEON Industrial COM Express Module Type 10 Compact Size

Features: ● Equipped with 13th generation Intel Core i7-1365UE / i5-1335UE / i3-1315UE / U300E ● Onboard LPDDR5 x 1 (up to 16GB) ● eDP x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe [x1] x 4 ● Intel I226-IT GbE x 1 ● COM Express Type 10 (84mm x 55mm)

  • NANOCOM-RAP_2.jpg
  • NANOCOM-RAP_3.jpg
  • Embedded Board Computers
  • EXPRESS Module

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Industrial COM Express Module [AQ7-ADN]

AAEON Industrial COM Express with Intel Core i3-N305/N97/N50/Atom x7425E

Features: ● Equipped with Atom x7425E/N50/N97/Core i3-N305, maximum TDP of 15W ● Onboard LPDDR5 memory of 4/8GB (maximum 8GB) ● Onboard eMMC of 32/64GB (maximum 64GB) ● Realtek RTL8111H-CG 1GbE x 1 ● SATA 6Gb/s x 1 ● USB 2.0 x 6, USB 3.2 x 2 ● PCIe [x1] x 4 ● DC +5V ● Qseven standard: 70mm x 70mm

  • AQ7-ADN_2.jpg
  • AQ7-ADN_3.jpg
  • Embedded Board Computers
  • EXPRESS Module

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Industrial COM Express Module [NANOCOM-ADN]

AAEON Industrial COM Express with Intel Core i3-N305/N97/N50/Atom x7425E equipped.

Features: ● Equipped with Atom x7425E/N50/N97/Core i3-N305 ● LPDDR5 4800 MHz 8GB/16GB onboard (up to 16GB) ● eMMC 32GB/64GB onboard (up to 64GB) ● LVDS colay eDP x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen 2 x 2 ● PCIe [x1] x 4 ● Intel I226-V/IT 2.5GbE x 1 ● COM Express Type 10 (Dimensions: 84mm x 55mm)

  • NANOCOM-ADN_2.jpg
  • NANOCOM-ADN_3.jpg
  • Embedded Board Computers
  • EXPRESS Module

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